This datasheet is made available for informational purposes only. For more information, such as processing guidance and full range of material options, this page includes design guidance that can help you start a new PCB project. For specific processing documentation and additional information, please visit the manufacturer's website.
The Rogers RO4830™ High Frequency Laminates are engineered for high-performance applications, particularly in the 76-81 GHz range, making them ideal for automotive radar sensors. This material is a cost-effective alternative to traditional PTFE-based laminates, offering a dielectric constant of 3.2 at 77 GHz. The laminates are designed with LoPro® reverse treated copper foil, which significantly enhances their insertion loss performance, achieving an impressive 2.2 dB per inch at 77 GHz【4†RO4830 High Frequency Laminates Data Sheet.pdf】.
For PCB stackup design, the RO4830 laminates are available in dielectric thicknesses of 0.005” and 0.0094”, suitable for the cap layer on FR-4 multi-layer board designs. These thickness options, combined with the material's good laser drilling performance, provide flexibility and reliability in PCB design and fabrication. The material's compatibility with standard epoxy/glass (FR-4) processes and RO4400™ bond ply also facilitates integration into existing manufacturing workflows without requiring special handling or equipment【4†RO4830 High Frequency Laminates Data Sheet.pdf】.
When designing with RO4830, consider the following key features to optimize your PCB stackup:
Overall, Rogers RO4830™ laminates offer a robust platform for developing high-frequency PCBs, particularly for automotive radar and other millimeter-wave applications. The combination of cost efficiency, high performance, and ease of processing makes it a compelling choice for engineers looking to optimize their designs for advanced electronic systems【4†RO4830 High Frequency Laminates Data Sheet.pdf】.
This guide covers material properties, application-specific selection, and key considerations for high-voltage, RF, high-speed digital, and HDI PCBs.